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LAI-A8125
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Model #: LAI-A8125
* Whole number only
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Key Applications
- High Performance Computing
- AI/Deep Learning Training
- Industrial Automation, Retail
- Climate and Weather Modeling
Key Features
- High density 8U system with NVIDIA® HGX™ H100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ + NVIDIA® NVSwitch™; 8 NIC for GPU direct RDMA (1:1 GPU Ratio)
- 24 DIMM Slots; Up to 6TB DRAM; 4800 ECC DDR5 LRDIMM;RDIMM;
- 8 PCIe Gen 5.0 X16 LP, and up to 4 PCIe Gen 5.0 X16 FHFL Slots
- Flexible networking options
- 2x 2.5" Hot-swap SATA drive bays; 1 M.2 NVMe for boot drive only; up to 16x 2.5" Hot-swap NVMe drive bays (12 by default + 4 optional)
- 10 heavy duty fans with optimal fan speed control
- 6x 3000W redundant Titanium level power supplies
Specifications
| part number LAI-A8125 |
| Processor |
| CPU |
- Dual Socket SP5
- AMD EPYC™ 9004 Series Processors
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| Core Count |
- Up to 128C/256T
- Note: Supports up to 400W TDP CPUs (Air Cooled)
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| GPU |
| Max GPU Count |
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| Supported GPU |
- NVIDIA SXM: HGX H100 8-GPU (80GB)
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| CPU-GPU Interconnect |
- PCIe 5.0 x16 CPU-to-GPU Interconnect
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| GPU-GPU Interconnect |
- NVIDIA® NVLink® with NVSwitch™
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| System Memory |
| Memory Capacity |
- 24 DIMM slots
- Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
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| Memory Voltag |
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| Onboard Devices |
| Chipset |
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| Network Connectivity |
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| NVMe |
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| Input / Output |
| Video |
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| Expansion Slots |
| PCI-Express (PCIe) |
- 8 PCIe 5.0 x16 LP slot(s)
- 2 PCIe 5.0 x16 FHFL slot(s)
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| Drive Bays / Storage |
Drive Bays
Configuration
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- Default: Total 18 bay(s)
- 2 front hot-swap 2.5" SATA drive bay(s); 4 front hot-swap 2.5" NVMe* drive bay(s); 12 front hot-swap 2.5" NVMe drive bay(s) (*NVMe support may require additional storage controller and/or cables, please call for details)
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| M.2 |
- 1 M.2 NVMe slot(s) (M-key)
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| Chassis |
| Form Factor |
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| Chassis |
- Height 14" (355.6mm)
- Width 17.2" (437mm)
- Depth 33.2" (843.28mm)
- Net Weight 166 lbs (75.3 kg)
- Gross Weight 225 lbs (102.1 kg)
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