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LAI-A2145

LAI-A2145 System View
Price: call for pricing
Model #: LAI-A2145

Key Applications

  • Artificial Intelligence (AI)
  • Cloud Solution Provider (CSP)
  • Research Lab
  • Large Language Model (LLM)
  • High Performance Comptue (HPC)

Key Features

  • Quad AMD Instinct™ MI300A processors
  • HBM3 Stacks 512GB
  • Optional PCIe configurations up to 6 PCIe slots x16 FHHL
  • Flexible networking options with 2 AIOM networking slot (OCP NIC 3.0 compatible)
  • Refault 8x 2.5" Hot-swap NVMe or Optional 8x 2.5" SAS3/SATA3 via storage add-on card; 2x internal M.2 NVMe/SATA
  • 3 heavy duty fans w/ Liquid Cooled
  • 4x 2700W redundant Titanium level power supplies

Specifications

part number LAI-A2145
Processor
CPU
  • Quad Socket SH5
  • AMD  Instinct™ MI300A Accelerated Processing Units (APUs)
  • Note: Supports up to 760W TDP CPUs (Liquid Cooled)
GPU
Max GPU Count
  • Up to 4 onboard GPU(s)
Supported GPU
  • AMD: Instinct MI300A APU
System Memory
Memory 
  • Onboard Memory
  • Max Memory: Up to 512GB ECC HBM3
Onboard Devices
Chipset
  • AMD SH5
Network Connectivity
  • Via AIOM
Input / Output
Video
  • 1 VGA port
  • 1 DisplayPort port(s)
LAN
  • 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB
  • 2  USB 3.0 port(s) (rear)
  • 2 USB 3.0 port(s) (front)
Serial
  • 1  COM port(s) (Rear
Drive Bays / Storage
Drive Bays
Configuration
  • Default: Total 8 bay(s)
  • 8 front hot-swap 2.5" NVMe drive bay(s)
  • Option A: Total 8 bay(s); 8 front hot-swap 2.5" SAS*/SATA* drive bay(s)(*SAS/SATA support may require additional storage controller and/or cables, please call for details)
M.2
  • 2 M.2 NVMe slot(s) (M-key)
Chassis
Form Factor
  • 2U Rackmount
Chassis
  • Height 3.5" (88 mm)
  • Width 17.3" (438.4 mm)
  • Depth 33.4" (848.7 mm)
  • Net Weight   45.5 lbs (20.64 kg)
  • Gross Weight  71.5 lbs (32.43 kg)

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