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LAI-A2115

LAI-A2115 System View
Price: call for pricing
Model #: LAI-A2115

Key Applications

  • Software-defined Storage
  • Data Intensive HPC
  • NVMe Over Fabrics Solution
  • In-Memory Computing
  • Private & Hybrid Cloud

Key Features

  • Single Socket SP5 AMD EPYC™ 9004 Series processors. Up to 360W TDP
  • Supports 24 DIMMs with 2DPC, up to 6TB memory capacity with 24 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory
  • Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant)
  • 32x hot-swap E3.S (7.5mm) NVMe drive bays
  • Redundant Titanium 2000W Power Supplies

Specifications

part number LAI-A2115
Processor
CPU
  • Single Socket SP5
  • AMD EPYC™ 9004 / 7003 Series Processors
  • Note: Supports 200W - 360W TDP CPUs (Air Cooled)
System Memory
Memory 
  • 24 DIMM slots
  • Max Memory (1DPC): Up to 4TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
  • Max Memory (2DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
Memory Voltag
  • 1.1V
Onboard Devices
Chipset
  • AMD System on Chip
Network Connectivity
  • Via AIOM
Input / Output
Video
  • 1 VGA port
LAN
  • 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB
  • 2  USB 3.0 port(s) (rear)
  • 2 USB 3.0 port(s) (front)
Drive Bays / Storage
Drive Bays
Configuration
  • Default: Total 34 bay(s)
  • 32 front hot-swap E3.S 1T NVMe drive bay(s)
  • 2 rear hot-swap 2.5" SATA drive bay(s)
M.2
  • 2  M.2 NVMe slot(s) (M-key 2280/22110)
Chassis
Form Factor
  • 2U Rackmount
Chassis
  • Height 3.5" (89.8 mm)
  • Width 17.2" (438.4 mm)
  • Depth 30.8" (789.9 mm)
  • Net Weight   55 lbs (24.95 kg)
  • Gross Weight  77 lbs (34.93 kg)

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