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LAI-A1115
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Model #: LAI-A1115
* Whole number only
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Key Applications
- Software-defined Storage
- Data Intensive HPC
- NVMe Over Fabrics Solution
- In-Memory Computing
- Private & Hybrid Cloud
Key Features
- Single Socket SP5 AMD EPYC™ 9004 Series processors. Up to 300W TDP.
- Supports 24 DIMMs with 2DPC, up to 6TB memory capacity with 24 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory
- Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant)
- 16x hot-swap E3.S (7.5mm) NVMe drive bays
- Redundant Titanium 1600W Power Supplies
Specifications
| part number LAI-A1115 |
| Processor |
| CPU |
- Single Socket SP5
- AMD EPYC™ 9004 Series Processors
- Note: 200W - 300W TDP CPUs (Air Cooled)
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| Core Count |
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| System Memory |
| Memory |
- 24 DIMM slots
- Max Memory (2DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
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| Memory Voltag |
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| Onboard Devices |
| Chipset |
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| Network Connectivity |
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| Input / Output |
| Video |
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| LAN |
- 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
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| USB |
- 2 USB 3.0 port(s) (rear)
- 2 USB 3.0 port(s) (front)
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| Drive Bays / Storage |
Drive Bays
Configuration |
- Default: Total 16 bay(s)
- 16 front hot-swap E3.S 1T NVMe drive bay(s)
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| M.2 |
- 2 M.2 NVMe slot(s) (M-key 2280/22110)
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| Chassis |
| Form Factor |
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| Chassis |
- Height 1.7" (43.6 mm)
- Width 17.2" (438.4 mm)
- Depth 30.4" (773.25 mm)
- Net Weight 48 lbs (21.8 kg)
- Gross Weight 68.74 lbs (31.2 kg)
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