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LAI-822
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Model #: LAI-822
* Whole number only
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Key Applications
- Industrial Automation
- Drug Discovery
- Climate and Weather Modeling
- Massive-scale AI Training
- LLMs & Multi-modal LLMs
- Fraud Detection and Fintech
Key Features
- Dual Intel® Xeon® 6900 series processors with P-cores
- Support for up to 24 DIMMs DDR5-6400 and 8800MT/s MRDIMMs
- Support for 8 Gaudi® 3 OAM GPUs
- 6 On-board OSFP 800GbE ports
- Up to 2 PCIe 5.0 x16 FHFL and 2 PCIe 5.0 x8 FHFL slots; Default AIOM dual port 10GBase-T
- Up to 8 2.5" hot-swap NVMe Gen5 drive bays
- 8x 3000W (4+4) redundant Titanium level power supplies
Specifications
part number LAI-822 |
Processor |
CPU |
- Dual Socket BR (LGA-7529)
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Core Count |
- Up to 128C/256T; Up to 504MB Cache per CPU
- Note: Supports up to 500W TDP CPUs (Air Cooled)
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GPU |
Max GPU Count |
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Supported GPU |
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CPU-GPU Interconnect |
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GPU-GPU Interconnect |
- 24x 200Gbe (48 x 112Gbps) PAM4 SerDes links split
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System Memory |
Memory Capacity |
- 24 DIMM slots
- Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM/LRDIMM
- Max Memory (2DPC): Up to 6TB 8800MT/s ECC DDR5 MRDIMM
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Onboard Devices |
Chipset |
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Network Connectivity |
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Input / Output |
LAN |
- 1 RJ45 1 GbE Dedicated BMC LAN port
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USB |
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Video |
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Expansion Slots |
PCI-Express (PCIe) |
- 2 PCIe 5.0 x16 FHFL slots
- 2 PCIe 5.0 x8 FHFL slots
- 1 PCIe 5.0 x4 AIOM slot (OCP 3.0 compatible)
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Drive Bays / Storage |
Drive Bays Configuration |
- Default: Total 8 bays
- 8 front hot-swap 2.5" PCIe 5.0 NVMe drive bays
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M.2 |
- 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 22110(default))
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Chassis |
Form Factor |
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Chassis |
- Height 13.8" (356 mm)
- Width 17.6" (447 mm)
- Depth 33.2" (800 mm)
- Net Weight 308 lbs (140 kg)
- Gross Weight 282 lbs (128 kg)
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