LAI-822

LAI-822 System View
Price: call for pricing
Model #: LAI-822

Key Applications

  • Industrial Automation
  • Drug Discovery
  • Climate and Weather Modeling
  • Massive-scale AI Training
  • LLMs & Multi-modal LLMs
  • Fraud Detection and Fintech

Key Features

  • Dual Intel® Xeon® 6900 series processors with P-cores
  • Support for up to 24 DIMMs DDR5-6400 and 8800MT/s MRDIMMs
  • Support for 8 Gaudi® 3 OAM GPUs
  • 6 On-board OSFP 800GbE ports
  • Up to 2 PCIe 5.0 x16 FHFL and 2 PCIe 5.0 x8 FHFL slots; Default AIOM dual port 10GBase-T
  • Up to 8 2.5" hot-swap NVMe Gen5 drive bays
  • 8x 3000W (4+4) redundant Titanium level power supplies

Specifications

part number LAI-822
Processor
CPU
  • Dual Socket BR (LGA-7529)
Core Count
  • Up to 128C/256T; Up to 504MB Cache per CPU
  • Note: Supports up to 500W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 8 onboard GPU(s)
Supported GPU
  • Intel OAM: Gaudi 3
CPU-GPU Interconnect
  • PCIe 5.0 x16
GPU-GPU Interconnect
  • 24x 200Gbe (48 x 112Gbps) PAM4 SerDes links split
System Memory
Memory Capacity
  • 24 DIMM slots
  • Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM/LRDIMM
  • Max Memory (2DPC): Up to 6TB 8800MT/s ECC DDR5 MRDIMM
Onboard Devices
Chipset
  • System on Chip
Network Connectivity
  • OSFP 800GbE
Input / Output
LAN
  • RJ45 1 GbE Dedicated BMC LAN port
USB
  • USB 3.0 Type-A ports
Video
  • 1 VGA port
Expansion Slots
PCI-Express (PCIe)
  • PCIe 5.0 x16 FHFL slots
  • PCIe 5.0 x8 FHFL slots
  •  PCIe 5.0 x4 AIOM slot (OCP 3.0 compatible)
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 8 bays
  • front hot-swap 2.5" PCIe 5.0 NVMe drive bays
M.2
  • 2  M.2 PCIe 5.0 x2 NVMe slots (M-key 22110(default))
Chassis
Form Factor
  • 8U Rackmount
Chassis
  • Height 13.8" (356 mm)
  • Width 17.6" (447 mm)
  • Depth 33.2" (800 mm)
  • Net Weight  308 lbs (140 kg)
  • Gross Weight  282 lbs (128 kg)

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